325 FLUX TYPE R
This flux is suitable for automatic soldering of PCBs used
in communication, defence and space application equipment.
It is capable of providing adequate improvement in wetting
of oxidised surface, and able to effectively control surface
tension at solder - PCB interface, leading to smaller solder
fillet and reduction in solder defect. It can be applied by
foam, dip, spray or brush. The flux residue left after soldering
is non-conductive and non-hygroscopic. For cleaning the residue
use HYBRID # 1000 series cleaning solvents.
433
FLUX TYPE RMA
This flux is mildly activated and is suitable for automatic
soldering of PCB's used in communication, defence and space
application equipment and also for a wide variety of electronic
soldering application. It's activity is slightly higher than
R type. It is capable of providing substantial improvement
in wetting of oxidised surface and able to effectively control
surface tension at solder - PCB interface leading to smaller
solder fillet and reduction in solder defect. These are excellent
foam fluxes and can also be applied by dip, spray or brush.
The flux residue left after soldering is non-conductive and
non-hygroscopic. For cleaning the residue use HYBRID # 1000
series cleaning solvents.
515,
529 FLUX TYPE RA
Suitable for both hand and automated soldering of plated through
hole and surface mount devices. It is a fully activated rosin
flux and could be used on all critical electronic assembles,
especially when oxidation level in PCB's and components is
non-uniform. These are suitable for soldering metals coated
with cadmium, copper, gold, silver and tin. The residue is
non-hygroscopic and non-tacky.
533 FLUX TYPE RA - LOW SOLID
Suitable for both hand and automated soldering of plated through
hole and surface mount devices, it is a very high purity RA
type flux that can be used on all critical electronic assembles,
especially when oxidation level in PCB's and components is
non-uniform. Its low solid content results in low residue.
Specially formulated for foam fluxing of PCB's, and also for
SMT applications, it is dependable for soldering on copper,
brass, copper bearing alloys, tin plate, cadmium and gold
plated surfaces. With low capillary action of raw flux, but
good capillary action of solder, it provides instant wetting,
less rejects and fewer touch ups. Though this product is active
(RA category), cleaning effort to remove its residue would
be much less in comparison with R or RMA type flux.
|
325 |
433 |
515 |
529 |
533 |
TYPE |
R |
RMA |
RA |
RA-T |
RA Low Solid |
FLUX CLASSIFICATION AS
PER J-STD-004 |
ROL0 |
ROM0 |
ROM1 |
ROM1 |
ROM1 |
PHYSICAL STATE |
Clear Liquid |
Clear Liquid |
Clear Liquid |
Clear Liquid |
Clear Liquid |
SPECIFIC GRAVITY |
0.85 @ 25°C |
0.875 @ 25°C |
0.827 @ 25°C |
0.84@ 25°C |
0.795 @ 25°C |
SOLIDS CONTENT |
25% |
35% |
18% |
25% |
4% |
COLOUR |
Amber |
Amber |
Amber |
Amber |
Pale Amber |
FLASH POINT |
16°C (TCC) |
16°C (TCC) |
16°C (TCC) |
20°C (TCC) |
16°C (TCC) |
PERCENT HALIDE |
Nil |
Nil |
0.35 to 0.5 |
0.35 to 0.5 |
0.35 to 0.5 |
WATER EXTRACT RESISTIVITY |
200,000 ohm |
100,000 ohm |
50,000 ohm |
50,000 ohm |
50,000 ohm |
RESIDUE |
Non-conductive,Non-hygroscopic,
Non-corrosive |
Non-conductive,Non-hygroscopic,Non-corrosive |
Non-tacky, Non-hygroscopic |
Non-tacky, Non-hygroscopic |
Low
residue due to low solid content, Non-tacky |
RESIDUE REMOVAL |
Clean with Hybrid 1000 series solvent
cleaners or saponifier, if required |
Clean with Hybrid 1000 series solvent
cleaners or saponifier, if required |
Clean with Hybrid 1000 series solvent
cleaners or saponifier, if required |
Clean with Hybrid 1000 series solvent
cleaners or saponifier, if required |
Consumption of solvent for residue
removal is low due to low solid content of the flux |
RECOMMENDED THINNER |
325-T |
433-T |
515-T |
529-T |
533-T |